| 标题 |
500 μm heavy micro-alloyed Cu wire for IGBT application: The study on microstructure characteristics, electrical fatigue fracture mechanism and bonding reliability |
| 网址 | |
| DOI | |
| 其它 |
期刊:Microelectronics and reliability 作者:Bo Wu; Fei-Yi Hung; K. Chan 出版日期:2024-11-01 |
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(2025-6-4)