| 标题 |
Geometry-driven physics-of-failure lifetime analysis of aluminum bonding wires in discrete SiC power electronics |
| 网址 | |
| DOI | |
| 其它 |
期刊:Microelectronics Reliability 作者:Borja Kilian; Youssef Maniar; Jonas Gleichauf; Olaf Wittler; Martin Schneider-Ramelow 出版日期:2025 |
| 求助人 | |
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(2025-6-4)