| 标题 |
Investigation of modified polyethylene glycol with nitrogen-containing purine groups as leveler for copper electroplating of through-holes with high aspect ratio of 10:1 |
| 网址 | |
| DOI | |
| 其它 |
期刊:Materials Today Chemistry 作者:Pubiao Yang; Meng Rao; Yu Wang; Wenyu Chen; Hongbin Cui; et al 出版日期:2026-09-01 |
| 求助人 | |
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(2025-6-4)