| 标题 |
Measurement of Thermal, Humidity, Solder, and Aging Effects of Mechanical Stress and Silicon Circuit Electrical Performance in Quad Flat Packages |
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| DOI | |
| 其它 |
期刊:2025 IEEE 75th Electronic Components and Technology Conference (ECTC) 作者:Carl Riehm; Tobias Chlan; Szabolcs Molnar; Vartika Verma; Ralf Brederlow 出版日期:2025-05-27 |
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(2025-6-4)