| 标题 |
Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Physics D 作者:Yuan Qin; Benjamin Albano; Joseph Spencer; James Spencer Lundh; Boyan Wang; et al 出版日期:2023-01-20 |
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(2025-6-4)