| 标题 |
Investigation of Reducing Bow during High Aspect Ratio Trench Etching in 3D NAND Flash Memory |
| 网址 | |
| DOI | |
| 其它 |
期刊:2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) 作者:Yuan Ye; Zhi-Liang Xia; Li-Peng Liu; Zong-Liang Huo 出版日期:2018 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)