| 标题 |
Fabrication with Semiconductor Packaging Technologies and Characterization of a Large‐Scale Flexible Thermoelectric Module |
| 网址 | |
| DOI | |
| 其它 |
期刊:Advanced Materials Technologies 作者:Tohru Sugahara; Yusufu Ekubaru; Ngo Van Nong; Noriko Kagami; Keiichi Ohata; et al 出版日期:2018-12-14 |
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(2025-6-4)