| 标题 |
Optimal thermo-mechanical reliability design of 2.5D lidless package |
| 网址 | |
| DOI | |
| 其它 |
期刊:2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) 作者:Junbo Yang; Chongyang Cai; Pengcheng Yin; Ke Pan; Yangyang Lai; et al 出版日期:2022-09-30 |
| 求助人 | |
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(2025-6-4)