| 标题 |
Effect of Bubble Behavior on the Morphology of Foamed Porous Copper Prepared via Electrodeposition |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of The Electrochemical Society 作者:Hebing Zhang; Yinghua Ye; Ruiqi Shen; Chengbo Ru; Yan Hu 出版日期:2013-01-01 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)