| 标题 |
Calculation Method and Analysis of Copper Layer Thickness of Copper-clad Steel for Grounding |
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| DOI | |
| 其它 |
期刊:2025 IEEE 3rd International Conference on Power Science and Technology (ICPST) 作者:Ting Wang; Guanhua Li; Ke Huang; Juyong Cui; Weigang Zheng; Dongpeng Sui 出版日期:2025-07-31 |
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(2025-6-4)