| 标题 |
[高分]
Ultrasonic Guided Wave Inspection and Characterization of Integrated Circuit Packages with Delamination |
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| DOI | |
| 其它 |
期刊:Structural Health Monitoring 2017 作者:JAVAID IKRAM; GUOYI LI; RAJESH K. NEERUKATTI; ADITI CHATTOPADHYAY 出版日期:2017 |
| 求助人 | |
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(2025-6-4)