| 标题 |
High frequency characterization and analytical modeling of through glass via (TGV) for 3D thin-film interposer and MEMS packaging |
| 网址 | |
| DOI | |
| 其它 |
期刊:2013 IEEE 63rd Electronic Components and Technology Conference 作者:Cheolbok Kim; Yong-Kyu Yoon 出版日期:2013-08-14 |
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(2025-6-4)