| 标题 |
The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface |
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| DOI | |
| 其它 |
期刊:Journal of Materials Research and Technology 作者:Shaoan Wang; Xiangyu Chen; Keyu Luo; Hongzhi Zhou; Rongqing Li; et al 出版日期:2023-11-01 |
| 求助人 | |
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(2025-6-4)