| 标题 |
A variational-damage-based thermo-mechanical phase-field model for fracture analysis of electronic packaging structures |
| 网址 | |
| DOI | |
| 其它 |
期刊:Engineering Fracture Mechanics 作者:Yanpeng Gong; Letong Zhang; Ya Duan; Tong An; Xiaoying Zhuang; et al 出版日期:2026-11-01 |
| 求助人 | |
| 下载 |
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(2025-6-4)