| 标题 |
Novel Low-Temperature Curable Positive-Tone Photosensitive Dielectric Materials with High Elongation for Panel Level Package |
| 网址 | |
| DOI | |
| 其它 |
期刊:Wafer-Level Packaging Symposium 作者:Hitoshi Araki; Yu Shoji; Yuki Masuda; Keika Hashimoto; Kimio Isobe; et al 出版日期:2025-12-02 |
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(2025-6-4)