| 标题 |
Double-sided cooling for high power IGBT modules using flip chip technology |
| 网址 | |
| DOI | |
| 其它 |
期刊:IEEE Transactions on Components and Packaging Technologies 作者:C. Gillot; C. Schaeffer; C. Massit; L. Meysenc 出版日期:2001 |
| 求助人 | |
| 下载 |
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(2025-6-4)