| 标题 |
Machine Learning-Enhanced Finite Element Analysis for Warpage and Stress Prediction in Glass Substrates |
| 网址 | |
| DOI |
10.1115/imece2025-164929
doi
|
| 其它 |
期刊:Volume 9: Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk and Reliability Analysis; Special Symposium on Additive Manufacturing on Benchmark Test Series; Special Symposium on Power; Research Posters 作者:Jui-Chang Chuang; Chang-Chun Lee; Wei-Cheng Tsai; Man-Ning Lu; Nguyen Son Vinh 出版日期:2025-11-16 |
| 求助人 | |
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(2025-6-4)