| 标题 |
Design and development of power module co-packaged with SiC GTO and SiC PiN |
| 网址 | |
| DOI | |
| 其它 |
期刊:2018 19th International Conference on Electronic Packaging Technology (ICEPT) 作者:Yingkun Yang; Lei Gao; Zhiqiang Li; Kun Zhou; Lin Zhang; et al 出版日期:2018-10-09 |
| 求助人 | |
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(2025-6-4)