| 标题 |
Effects of Ar Plasma Treatment on the Properties of TaN/Ta Barrier for Copper Interconnects in Advanced 3D NAND Memory |
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| DOI | |
| 其它 |
期刊:ECS Journal of Solid State Science and Technology 作者:Xianglie Sun; Shuliang Lv; Yuan Li; Jun Luo; Chi Huang; et al 出版日期:2019-12-03 |
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(2025-6-4)