| 标题 |
Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications |
| 网址 | |
| DOI |
10.1115/ipack2021-74060
doi
|
| 其它 |
期刊:ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems 作者:Pradeep Lall; Padmanava Choudhury; Scott Miller 出版日期:2021-10-26 |
| 求助人 | |
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(2025-6-4)