| 标题 |
Effect of Cross-Interaction between Ni and Cu on Growth Kinetics of Intermetallic Compounds in Ni/Sn/Cu Diffusion Couples during Aging |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Electronic Materials 作者:K. Hong; J. Ryu; C. Y. Park; J. Huh 出版日期:2008-01-01 |
| 求助人 | |
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(2025-6-4)