| 标题 |
Polyaniline graphene composite conductive film formed by in-situ polymerization combined with the self-assembly method as a conductive seed layer for printed circuit board hole metallization |
| 网址 | |
| DOI | |
| 其它 |
期刊:Applied Surface Science 作者:Peng Sun; Xiao Zhang; Xixun Shen; Runlin Wang; Zihao Zhang; et al 出版日期:2026 |
| 求助人 | |
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(2025-6-4)