| 标题 |
Engineering designed functional covalent organic frameworks via pore surface modifications for effectively reducing the dielectric constant of polyimide-based electronic packaging materials |
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| DOI | |
| 其它 |
期刊:Polymer 作者:Wanjing Zhao; Xianwu Cao; Robert K.Y. Li; Wei Wu 出版日期:2024-10-23 |
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(2025-6-4)