| 标题 |
Inspection of Flip Chip and Chip Scale Package Interconnects Using Laser Ultrasound and Interferometric Techniques
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| 其它 | Howard T , Erdahl D , Ume I C ,et al.Inspection of Flip Chip and Chip Scale Package Interconnects Using Laser Ultrasound and Interferometric Techniques[J].International Journal of Microcircuits & Electronic Packaging, 2002, 25(1):p.1-14.DOI:1063-1674(2002)25:1<1:IOFCAC>2.0.TX;2-7. |
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