| 标题 |
Analysis of Shrinkage-Induced Dimensional Mismatch in 3D-Printed Packaging Substrates for Flip-Chip Bonding |
| 网址 | |
| DOI | |
| 其它 |
期刊:2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS) 作者:Haksoon Jung; Yurim Choi; Kyungsun Kim; Nahyeon Kim; Jimin Kwon 出版日期:2026-04-14 |
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(2025-6-4)