| 标题 |
TSV Redundancy: Architecture and Design Issues in 3-D IC |
| 网址 | |
| DOI | |
| 其它 |
期刊:IEEE Transactions on Very Large Scale Integration (vlsi) Systems 作者:A. Hsieh; TingTing Hwang 出版日期:2012-04-01 |
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(2025-6-4)