Advanced 3D Wafer Level System Integration Technology

Data centric era has come and prevails across cloud, networking and edge applications. AI and 5G applications, such as intelligent manufacturing, AR/VR, connected devices and smart cars, are generating an explosion of data. This deluge of data demands for an unprecedented amount of computing power in cloud datacenters and communication infrastructures, to process numerous images, audio/video files, and business analytics workloads. Semiconductor industry urges a system integration solution with high computing power, wide data bandwidth, low energy consumption and low latency to realize high performance computing and high speed communication for cloud, server and edge AI. Among advanced system integration solutions, wafer level system integration (WLSI) technology is a unique and powerful 2D/3D integration platform to offer 3D die stacking balancing high interconnect density, short interconnect path and minimized bonding interface impedance to fulfill the demands by cutting-edge AI at a high level, for HPC and mobile applications. [1] [2] [3] 3D WLSI further realizes 3D system scaling to be complementary to transistor scaling for future intelligent AI systems.