材料科学
可伸缩电子设备
数码产品
导线
弹性体
液态金属
导电体
柔性电子器件
光电子学
双层
纳米技术
复合材料
电气工程
生物
工程类
遗传学
膜
作者
Shuwen Chen,Shicheng Fan,Jiaming Qi,Ze Xiong,Zheng Qiao,Zixiong Wu,Joo Chuan Yeo,Chwee Teck Lim
标识
DOI:10.1002/adma.202208569
摘要
Abstract Human‐interfaced electronic systems require strain‐resilient circuits. However, present integrated stretchable electronics easily suffer from electrical deterioration and face challenges in forming robust multilayered soft‐rigid hybrid configurations. Here, a bilayer liquid‐solid conductor (b‐LSC) with amphiphilic properties is introduced to reliably interface with both rigid electronics and elastomeric substrates. The top liquid metal can self‐solder its interface with rigid electronics at a resistance 30% lower than the traditional tin‐soldered rigid interface. The bottom polar composite comprising liquid metal particles and polymers can not only reliably interface with elastomers but also help the b‐LSC heal after breakage. The b‐LSC can be scalably fabricated by printing and subsequent peeling strategies, showing ultra‐high strain‐insensitive conductivity (maximum 22 532 S cm −1 ), extreme stretchability (2260%), and negligible resistance change under ultra‐high strain (0.34 times increase under 1000% strain). It can act as stretchable vertical interconnect access for connecting multilayered layouts and can be scalably and universally fabricated on various substrates with a resolution of ≈200 µm. It is demonstrated that it can construct stretchable sensor arrays, multi‐layered stretchable displays, highly integrated haptic user‐interactive optoelectric E‐skins, visualized heaters, robot touch sensing systems, and wireless powering for wearable electronics.
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