散热片
传热
微通道
材料科学
小型化
被动冷却
热交换器中的铜
微电子
强化传热
微型热交换器
强化传热
机械工程
板翅式换热器
传热系数
机械
板式换热器
光电子学
纳米技术
工程类
物理
作者
Wenlin Dong,Xilong Zhang,Bilong Liu,Bin Wang,Yubao Fang
标识
DOI:10.1016/j.ijheatmasstransfer.2023.125001
摘要
Enhanced heat transfer technology can be divided into active technology and passive technology based on whether external power is consumed. Due to the absence of external energy consumption, passive technology is more reliable than active cooling technology. Microchannel heat sink (MCHS) are widely used for heat dissipation in the field of microelectronics. In recent years, due to the continuous miniaturization of electronic chips and the high heat flux per unit area (about 300 W/cm2), the passive enhanced heat transfer technology of microchannel heat sinks has developed rapidly. This article provides a comprehensive review of passive enhanced heat transfer technology in MCHS. It introduces the influence of channel configuration, secondary structure, combined structure, and different heat transfer media on the heat transfer capacity and pressure drop of microchannel heat sinks. Finally, a summary is given based on the collected data.
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