Integrated Microwave Photonics Multi‐Parameter Measurement System

微波食品加热 光子学 计算机科学 电子工程 光电子学 物理 电信 工程类
作者
Yong Zheng,Zhen Han,Liheng Wang,Pu Zhang,Yongheng Jiang,Huifu Xiao,Xudong Zhou,Mingrui Yuan,Mei Xian Low,Aditya Dubey,Thach G. Nguyen,Qinfen Hao,Guanghui Ren,Arnan Mitchell,Yonghui Tian
出处
期刊:Laser & Photonics Reviews [Wiley]
卷期号:19 (14) 被引量:4
标识
DOI:10.1002/lpor.202500013
摘要

Abstract Driven by the growing demands in wireless communication, remote sensing and emerging 6G networks, research on microwave signal measurement techniques has attached intensive attention. Unlike conventional electronic‐based approaches, photonics chip‐based microwave signal measurement systems offer significant advantages, including broad operation bandwidth, reduced weight, and enhanced resistance to unwanted electromagnetic interference. Despite notable progress in integrated microwave photonic measurement systems, the majority remains constrained by bandwidth below 30 GHz, primarily due to the limitation of modulators. Furthermore, most previous studies focus on the measurement of one single parameter, typically the frequency, limiting their applications in more complex, real‐world situations. Here, an on‐chip photonic microwave multi‐parameter measurement system is presented on the thin‐film lithium niobate (TFLN) platform. The system enables measurement of microwave frequency, phase, and amplitude, offering an ultra‐high bandwidth (up to 60 GHz) with low root‐mean‐squared errors: 450 MHz for frequency, 3.43° for phase, and 1.64% for amplitude. Additionally, the system is validated by the time‐domain reconstruction of unknown sinusoidal microwave signals based on measurement results. This demonstration further broadens the scope of integrated TFLN photonic devices for microwave signal measurement, providing a viable solution to the bandwidth limitations of existing microwave networks and addressing the increasing demands of future information‐driven technologies.
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