沟槽
功率MOSFET
材料科学
光电子学
MOSFET
工程物理
电气工程
纳米技术
电压
物理
晶体管
工程类
图层(电子)
作者
Mrunal A. Khaderbad,Ali Houadef,Chris Rogers,Ian Cousins,Parag C. Waghmare,Deepak Pandey,Wesley Chih-Wei Hsu,Mohammad Amanullah,E. Efthymiou,Sami Ould-Ahmed,T. Böttcher,Matthias Klingbeil
标识
DOI:10.1109/ispsd59661.2024.10579630
摘要
Trench power MOSFETs are widely used across consumer, automotive and industrial market segments for many applications. During switching, the reverse recovery charge (Qrr) associated with the body diode of the MOSFET, gives rise to spiking, ringing and efficiency losses. In this study, minority carrier lifetime reduction/killing using Platinum (Pt) in trench power MOSFETs is demonstrated in terms of Qrr reduction. Further, reduced Qrr levels due to the presence of Pt traps, created by two different methods are compared, i) by ion implantation (Pt IMP) and ii) by physical vapor deposition (Pt PVD).
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