材料科学
微观结构
双金属片
压痕硬度
铜
退火(玻璃)
冶金
极限抗拉强度
铝
电子背散射衍射
复合材料
透射电子显微镜
金属
纳米技术
作者
Irina Volokitina,Bayan Sapargaliyeva,Aktolkyn Agabekova,Andrey Volokitin,Samal Syrlybekkyzy,Alexandr Kolesnikov,G. A. Ulyeva,Almas Yerzhanov,Pavel Kozlov
标识
DOI:10.1016/j.cscm.2023.e02162
摘要
This article investigates the effect of a new processing technology on the change in microstructure and mechanical properties of bimetallic aluminum-copper wire. This technology makes it possible to produce a new generation of wire for use in the construction of new overhead lines and reconstruction of old ones. The study was conducted using a transmission electron microscope, EBSD analysis, tensile tests, and determination of microhardness and electrical conductivity. The results of the study show that an ultrafine-grained copper-aluminum composite with a gradient structure is formed during straining by ECAP-drawing. Annealing after straining at 200 °C increases the strength of the interfacial connection between Cu and Al and improves the strength characteristics of the bimetallic aluminum-copper wire. The use of such aluminum-copper wires for overhead transmission lines allows to reduce the wire cross-section and, accordingly, wind loads, as well as to increase the strength properties without an additional increase in the total weight of the wire.
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