Poly(3,4-ethylenedioxythiophene):Poly(styrene sulfonate) Inkjet Inks Doped with Carbon Nanotubes and a Polar Solvent: The Effect of Formulation and Adhesion on Conductivity

材料科学 聚(3,4-亚乙基二氧噻吩) 苯乙烯 磺酸盐 碳纳米管 导电聚合物 溶剂 高分子化学 电导率 化学工程 兴奋剂 极地的 粘附 共聚物 复合材料 纳米技术 聚合物 有机化学 化学 物理化学 工程类 冶金 光电子学 物理 天文
作者
Peter D. Angelo,Ramin Farnood
出处
期刊:Journal of Adhesion Science and Technology [Taylor & Francis]
卷期号:24 (3): 643-659 被引量:19
标识
DOI:10.1163/016942409x12561252292189
摘要

A conductive aqueous polymer suspension of poly(3,4-ethylenedioxythiophene):poly(styrene sulfonate), or PEDOT:PSS, was used as the basis for an inkjet-printable and translucent conductive material. Several types of surfactants were used to achieve suitable particle sizes for inkjet printing, with Zonyl™ FS-300 non-ionic surfactant providing suitable surface tension, stability and dispersion. Viscosity was controlled using water and glycerol. Glycerol was also included as a humectant. 10 w/w% polar solvent (dimethyl sulfoxide) was used to increase conductivity, as a co-solvent and as a viscosity modifier. Carbon nanotubes, both single- and multi-walled, were dispersed in the ink to further improve its conductivity. The optimized ink was printed onto coated photo-paper and cellulose acetate (CA) substrates and characterized for ink layer thickness and conductivity. The effect of paper folding and peeling of an adhesive strip from the ink surface on the conductivity of the printed samples was also characterized. Optical microscopy showed that the conductive ink was contained almost entirely in the pores of the photo-paper coating layer and fibres, but remained as a film on the CA surface. In the case of photo-paper, failure occurred primarily at the coating–paper interface. The cohesive failure compromised the conductivity of the PEDOT:PSS layer contained in the coating. In the case of CA (within the coating layer), the PEDOT:PSS film's conductivity was not significantly affected by folding or peeling. This suggests that PEDOT:PSS is a robust conductive material well-suited to applications requiring significant flexibility.
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