环氧树脂
热导率
材料科学
聚合物
单体
导电体
复合材料
无定形固体
电导率
化学工程
高分子化学
化学
有机化学
物理化学
工程类
作者
Guangxin Lv,Chengtian Shen,Naisong Shan,Elynn Jensen,Xiaoru Li,Christopher M. Evans,David G. Cahill
标识
DOI:10.1073/pnas.2211151119
摘要
Rapid developments in high-performance computing and high-power electronics are driving needs for highly thermal conductive polymers and their composites for encapsulants and interface materials. However, polymers typically have low thermal conductivities of ∼0.2 W/(m K). We studied the thermal conductivity of a series of epoxy resins cured by one diamine hardener and seven diepoxide monomers with different precise ethylene linker lengths ( x = 2–8). We found pronounced odd–even effects of the ethylene linker length on the liquid crystalline order, mass density, and thermal conductivity. Epoxy resins with even x have liquid crystalline structure with the highest density of 1.44 g/cm 3 and highest thermal conductivity of 1.0 W/(m K). Epoxy resins with odd x are amorphous with the lowest density of 1.10 g/cm 3 and lowest thermal conductivity of 0.17 W/(m K). These findings indicate that controlling precise linker length in dense networks is a powerful route to molecular design of thermally conductive polymers.
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