Crosslinking Vinyl‐Addition Polynorbornenes via Difunctional Diazirines to Generate Low Dielectric‐Constant and Low Dielectric‐Loss Thermosets

Abstract Thermosets having low dielectric constant ( D k < 3) and low dielectric dissipation factor ( D f < 0.003), high glass transition temperature ( T g > 150 °C), and good adhesion to copper are desirable for the low loss layers of the copper clad laminates (CCL) in next generation printed circuit boards. Three different difunctional diazirines are evaluated for both thermal and photochemical crosslinking of a high T g vinyl‐addition polynorbornene resin: poly(5‐hexyl‐1‐norbornene) (poly(HNB)). The substrate polymer, crosslinked by the carbenes generated from the activated diazirines, forms thermosets with D k < 2.3 and D f < 0.001 at 10 GHz depending on the identity of the diazirine and the loading. The D k and D f values for one composition are stable for 1600 h at 125 °C in air and for 1400 h at 85 °C and 85% relative humidity, suggesting good long‐term reliability of this thermoset. Adhesion of poly(HNB) to copper can be enhanced by priming the copper surface with a diazirine prior to high temperature lamination; peel strength values of greater than 7.5 N cm −1 are achieved. Negative‐tone photopatterning of poly(HNB) with diazirines upon exposure to 365 nm light is demonstrated.