材料科学
制冷
电热效应
陶瓷
热导率
界面热阻
电容器
数码产品
工程物理
热阻
复合材料
热的
机械工程
水冷
光电子学
耐久性
储能
电介质
三元运算
高效能源利用
冷却能力
热电材料
热能
主动冷却
纳米技术
能源消耗
聚偏氟乙烯
热电效应
石墨烯
辐射冷却
消散
冷藏车
保温
作者
Shumao Xu,Xiujun Fan,Songyue Chen,Jeong Min Baik,Jun Chen
标识
DOI:10.1002/adfm.202506625
摘要
Abstract Electrocaloric cooling has emerged as a promising solid‐state substitute for traditional vapor‐compression refrigeration, driven by the need for environmentally friendly and energy‐efficient technologies. This review hightlights recent advances in ceramic ferroelectrics in multilayer ceramic capacitors (MLCCs) and polyvinylidene fluoride (PVDF) copolymers‐based efficient, self‐oscillating soft refrigeration systems. The introduction of lead‐free ceramic ferroelectrics in MLCCs has significantly enhanced the performance and durability of electrocaloric cooling systems, making them energy‐efficient and capable of withstanding extensive operational cycles. Simultaneously, ternary copolymers, P(VDF‐TrFE‐CFE) and P(VDF‐TrFE‐CTFE) along with their composites and modified derivatives have demonstrated superior promise due to their enhanced polarization‐field coupling and fatigue resistance compared to irradiated copolymers. These systems leverage their high thermal conductivity and substantial electrocaloric responses to facilitate rapid heat dissipation without external mechanical components, enabling efficient electronic thermal management. The synergy between electro‐thermomechanical properties has paved the way for these solid‐state cooling technologies to potentially replace conventional systems, reducing energy consumption and eliminating the use of harmful refrigerants. This review underscores the pivotal role of molecular and interface engineering in eco‐friendly electrocaloric cooling solutions, focusing on enhancing cooling efficiency through optimized thermal load management, strategic dipole alignment to improve polarization‐field interaction, and the development of ceramic multilayer capacitors and irradiated P(VDF‐TrFE) with large adiabatic temperature changes and high energy densities, promising electronic thermal management and on‐chip cooling in advanced computing and telecommunications.
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