Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network

Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal–oxide–semiconductor field-effect transistor (MOSFET). To achieve superior reliability of packaging, we applied the nondominated sorting genetic algorithm with elitist strategy (NSGA-II) and ant colony optimization–backpropagation neural network (ACO–BPNN) to optimize the design of redistribution layer (RDL) in FOPLP. We first quantified the thermal resistance and thermomechanical coupling stress of the designed package under thermal cycling loading. Next, NSGA-II and ACO–BPNN were used to optimize the size of the RDL blind via. Finally, the effectiveness of the proposed reliability optimization methods was verified by performing thermal shock reliability aging tests on the prepared devices.