寄生元件
电感
绝缘栅双极晶体管
寄生提取
电压降
瞬态(计算机编程)
电气工程
材料科学
电压
晶体管
双极结晶体管
功率(物理)
下降(电信)
电磁干扰
寄生电容
共发射极
光电子学
电子工程
瞬态响应
循环(图论)
电流(流体)
控制理论(社会学)
还原(数学)
半导体器件
物理
工程类
信号(编程语言)
干扰(通信)
电压尖峰
作者
Yameng Sun,Xiong Yuan,Liming Han,Z. He,Anning Chen,Kun Ma,Xun Liu,Yifan Song,Xuehan Li,Xiao Zhang,Yang Zhou,Sheng Liu
标识
DOI:10.1109/icept67137.2025.11157486
摘要
During the turn-on transient of insulated gate bipolar transistors (IGBTs), the collector-emitter voltage (VCE) "bump" phenomenon is frequently observed. This voltage spike is characterized by an initial rapid drop in the VCE due to the presence of parasitic inductance, followed by a subsequent rise and fall of VCE as the collector current (IC) increases. This VCE bump critically exacerbates the IGBT turn-on losses (Eon). By analyzing the dynamic variation of dIC/dt during the turn-on process, this study reveals that suppressing the VCE bump fundamentally requires mitigating the initial negative variation of dIC/dt, which originates from interference between the power loop and the gate-signal loop induced by common-emitter parasitic inductance. A step-by-step approach was employed to decouple these loops by adjusting the positioning of the emitter signal terminals, thereby systematically reducing the common-emitter parasitic inductance. Experimental results demonstrate that minimizing common-emitter parasitic inductance effectively enhances the turn-on speed and reduces turn-on losses. When devices with identical turn-on speeds were compared, smaller common-emitter parasitic inductance correlated with a weaker VCE bump. Specifically, the study reveals that a reduction of 1 nH in common-emitter parasitic inductance decreases the Eon by approximately 0.1%.
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