材料科学
结晶度
光电子学
光电探测器
退火(玻璃)
碲
再结晶(地质)
薄膜
薄膜晶体管
响应时间
形成气体
钝化
硫化铅
石墨烯
激光器
溶解过程
电子迁移率
波长
脉冲激光器
脉冲激光沉积
闪光灯
氢
选择性激光熔化
进程窗口
通量
粒度
量子效率
硫化氢
纳米技术
作者
Chia-Hung Lo,Chia-Chen Chung,Pei-Hsuan Wang,Pei Hua Wu,You Jie-Lin,Sung-Tsun Wang,Cai‐Jhen Hsu,Seokwoo Jeon,Wei Hsuan Hung,Chang Hong Shen,Der Hsien Lien,Yu Lun Chueh,Chia-Hung Lo,Chia-Chen Chung,Pei-Hsuan Wang,Pei Hua Wu,You Jie-Lin,Sung-Tsun Wang,Cai‐Jhen Hsu,Seokwoo Jeon
标识
DOI:10.1002/adfm.202516546
摘要
Abstract Here, a pulsed laser annealing (PLA) process is employed to enhance the crystallinity and functional performance of tellurium (Te) thin‐film devices. The PLA facilitates localized melting followed by rapid cooling, which promotes recrystallization while significantly reducing energy loss compared to conventional thermal annealing techniques. Field‐effect transistors (FETs) incorporating a PLA‐treated Te film (10 nm) demonstrate a hole mobility of 107.9 cm 2 V −1 s −1 and a substantially improved on/off current ratio, underscoring their suitability for high‐performance electronic applications. Photodetectors based on the PLA‐treated Te film (10 nm) exhibit exceptional photoresponsivity of 72.94 A W −1 under light illumination with a wavelength of 408 nm, along with faster response time and improved detectivity, reflecting their enhanced optoelectronic functionality. For gas sensing measurements, PLA‐treated Te (10 nm) sensors achieve a nitrogen dioxide (NO 2 )response of 55.4% at 1 ppm, with rapid response and recovery times of 0.92 and 27.7 s, respectively. For detecting hydrogen sulfide (H 2 S) gas, the response improves to 98.3% at 10 ppm, with response and recovery times of 121.3 and 78.8 s. These improvements are attributed to the enhanced crystallinity, enlarged grain sizes, and smoother surface morphology induced by the PLA process.
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