期刊:Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs [Institute of Electrical and Electronics Engineers] 日期:2018-05-01卷期号:: 44-47被引量:26
标识
DOI:10.1109/ispsd.2018.8393598
摘要
Deep-P encapsulated 4H-SÌC trench MOSFET was proposed. The fabricated MOSFET with a blocking voltage of 1800V demonstrated a ultra low RonQgd of 133 nCmΩ. The structure optimization was carried out for switching-loss reduction. The improved switching characteristics were obtained by the balanced JFET resistance and the gate-drain capacitance.