Hydrogen-induced blistering mechanisms in thin film coatings

We report on the mechanisms of hydrogen-induced blistering of multilayer coatings. Blister formation is a result of highly localized delamination occurring at the two outermost metal-on-silicon interfaces. The number, size, and type of blisters formed varied depending on the composition and ion energy of the incident flux. The results are explained in terms of the multilayer structure being simultaneously susceptible to blistering via two independent mechanisms. A high density of small blisters developed when relatively energetic (several 100 eV) ions were present. Independently, a hydrogenation process that was facilitated by the presence of a small flux of low energy ions (≤ 50 eV) induced a low density of large blisters.