超声波传感器
PMUT公司
CMOS芯片
炸薯条
压电
材料科学
声学
薄脆饼
传感器阵列
电子工程
压电传感器
计算机科学
电气工程
光电子学
工程类
机器学习
物理
复合材料
作者
David A. Horsley,Yipeng Lu,Hao-Yen Tang,Xiaoyue Jiang,B.E. Boser,J. M. Tsai,Eldwin J. Ng,M. Daneman
标识
DOI:10.1109/ultsym.2016.7728817
摘要
This paper describes a single-chip 591×438 DPI ultrasonic fingerprint sensor. The sensor is based on a piezoelectric micromachined ultrasonic transducer (PMUT) array that is bonded at wafer-level to complementary metal oxide semiconductor (CMOS) signal processing electronics to produce a pulse-echo ultrasonic imager on a chip. To meet the 500 DPI standard for consumer fingerprint sensors, the PMUT pitch was reduced by approximately a factor of two relative to an earlier design. We conducted a systematic design study of the individual PMUT design and array to achieve this scaling while maintaining a high fill-factor. The resulting 110×56 PMUT array, composed of rectangular PMUTs achieved a 51.7% fill-factor, three times greater than that of the previous design. Together with the custom CMOS ASIC, the sensor achieves 75 micron lateral resolution and 150 micron axial resolution over a 4.6 mm × 3.2 mm image.
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