This paper deals with the effect of crystal orientation and environment on fatigue lifetime of single crystal silicon (SCS). Fatigue lifetime was examined with the same shape of specimen, with same level of applied stress in two different environment of lab air and hydrogen with two different crystal orientation specimens of (100) wafer with <110> notch orientation and (111) wafer with <11-2> notch orientation. The resulting lifetime shows slight difference in between two different crystal orientation specimens. But for the case of different environment there is no significant difference in lifetime for the both two type of specimen even though level of difference in relative humidity was 30%.