宽带
光子学
材料科学
太赫兹辐射
光电子学
带宽(计算)
无线
雷达
电子工程
光子集成电路
电子线路
光功率
铌酸锂
传输(电信)
光通信
计算机科学
数码产品
光调制器
波导管
数据传输
电气工程
氮化物
信号处理
作者
Liangjun Lu,Jinwei Su,Yuqin Yuan,Yiqi Dai,Aolong Sun,Shihuan Ran,W H Gao,Wen-Yuan Liu,Yinjun Liu,Junwen Zhang,Cheng Zeng,Boyu Dong,Yu Li,Nan Chi,Jinsong Xia,Jianping Chen,L. Zhou
标识
DOI:10.21203/rs.3.rs-8004021/v1
摘要
Abstract Photonic integrated circuits (PICs) have driven advances in optical interconnect, wireless communications, seamless sensing, etc. Among various components of PICs, electro-optic modulators serve as the critical bridge between the electronic and optical domains, acting as the cornerstone of these systems. To address the ultra-broadband demands of next-generation information systems while enabling heterogeneous integration with other functional components, we present a high-performance thin-film lithium tantalate-on-silicon nitride heterogeneous Mach-Zehnder modulator (MZM), fabricated via micro-transfer printing. The MZMs show an insertion loss of 1.0 dB, an electro-optic bandwidth exceeding 110 GHz, and a power drift of ~0.3 dB over 72 h at quadrature bias. We employ the modulator for three typical scenarios in the applications of optical communications, full photonic terahertz wireless communication, and radar sensing. Using the MZM, we achieve optical data transmission rates beyond 375 Gbps, a record of 148 Gbps for wireless communications in the D-Band, and a range resolution of 1.2 cm with measured errors below 2 mm in the W-Band. These results pave the way for scalable, high-performance, cross-domain photonic chips for next-generation information networks.
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