Improved AlScN/GaN heterostructures grown by metal-organic chemical vapor deposition

金属有机气相外延 异质结 化学气相沉积 材料科学 光电子学 外延 高电子迁移率晶体管 跨导 图层(电子) 晶体管 纳米技术 物理 电压 量子力学
作者
C. Manz,Stefano Leone,Lutz Kirste,Jana Ligl,Kathrin Frei,Theodor Fuchs,Mario Prescher,Patrick Waltereit,Marcel A. Verheijen,Andreas Graff,M. Simon-Najasek,Frank Altmann,M. Fiederle,O. Ambacher
出处
期刊:Semiconductor Science and Technology [IOP Publishing]
卷期号:36 (3): 034003-034003 被引量:51
标识
DOI:10.1088/1361-6641/abd924
摘要

Abstract AlScN/GaN epitaxial heterostructures have raised much interest in recent years, because of the high potential of such structures for high-frequency and high-power electronic applications. Compared to conventional AlGaN/GaN heterostructures, the high spontaneous and piezoelectric polarization of AlScN can yield to a five-time increase in sheet carrier density of the two-dimensional electron gas formed at the AlScN/GaN heterointerface. Very promising radio-frequency device performance has been shown on samples deposited by molecular beam epitaxy. Recently, AlScN/GaN heterostructures have been demonstrated, which were processed by the more industrial compatible growth method metal-organic chemical vapor deposition (MOCVD). In this work, SiN x passivated MOCVD-grown AlScN/GaN heterostructures with improved structural quality have been developed. Analytical transmission electron microscopy, secondary ion mass spectrometry and high-resolution x-ray diffraction analysis indicate the presence of undefined interfaces between the epitaxial layers and an uneven distribution of Al and Sc in the AlScN layer. However, AlScN-based high-electron-mobility transistors (HEMT) have been fabricated and compared with AlN/GaN HEMTs. The device characteristics of the AlScN-based HEMT are promising, showing a transconductance close to 500 mS mm −1 and a drain current above 1700 mA mm −1 .

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