稳健性(进化)
卷积神经网络
半导体器件制造
特征提取
故障检测与隔离
人工智能
薄脆饼
深度学习
计算机科学
数据建模
模式识别(心理学)
人工神经网络
工程类
电子工程
数据挖掘
电气工程
执行机构
化学
基因
数据库
生物化学
作者
Eunji Kim,Sungzoon Cho,Byeongeon Lee,Myoungsu Cho
标识
DOI:10.1109/tsm.2019.2917521
摘要
Nowadays, more attention has been placed on cost reductions and yield enhancement in the semiconductor industry. During the manufacturing process, a considerable amount of sensor data called status variables identification (SVID) is collected by sensors embedded in advanced machines. This data is a valuable source for data-driven automatic fault detection and diagnosis at an early manufacturing stage to maintain competitive advantages. However, wafer processing times vary slightly from wafer to wafer, resulting in variable-length signal data. The conventional approaches use much condensed data called fault detection and classification (FDC) data made by manually designed feature extraction. Or, recent deep learning approaches assume that all wafers have the same processing time, which is impotent to the variable-length SVID. To detect and diagnose faults directly from the variable-length SVID, we propose a self-attentive convolutional neural network. In experiments using real-world data from a semiconductor manufacturer, the proposed model outperformed other deep learning models with less training time and showed robustness at different sequence lengths. Compared to FDC data, SVID data showed better fault detection performance. Without manually investigating the lengthy sensor signals, abnormal sensor value patterns were found at the time specified by the model.
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