薄脆饼
材料科学
光电子学
炸薯条
硅
光刻
蚀刻(微加工)
半导体
干法蚀刻
谐振器
纳米技术
电气工程
工程类
图层(电子)
作者
Yanyan Zhi,Li Liu,Y.-B. He,Jiejun Zhang,Jie Li,Kun Zhang,Junkai Zhang,Liling Liu,Shuang-Qi Zhang,Jianping Yao,Bai‐Ou Guan
摘要
Optical microcavities with high quality factors can significantly enhance the intracavity power density and have become a superior platform for studying quantum electrodynamics, nonlinearities, and sensing. Minimized and compact on-chip devices require the integration of microcavities with versatile functions that can be implemented by techniques compatible with semiconductor industries. However, the silicon dry etch technique commonly used to shape silicon wafers limits the massive production of microcavities. Here, an all-wet etching technique is proposed to fabricate on-chip microcavities with the aid of photolithography. On-chip silica microdisks with quality factors of ∼105 are demonstrated, and optical modes with quality factors up to 106 are also observed. The proposed technique opens an avenue for economical, easy handling, and scalable production of on-chip microcavities using foundry-based technologies.
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