Investigations on the diffusion bonding of titanium alloy and aluminum alloy using copper at low bonding pressure

This research investigates the diffusion bonding of hybrid aluminum (Al)–titanium (Ti) joints using a copper (Cu) interlayer in a vacuum environment. At 610 °C and 1 MPa pressure, partial melting of Al caused deformation and misalignment, while 520 °C showed no melting of Al–Cu at the interface. A rod-shaped precipitate with primarily Al was observed at 550 °C, and grain coarsening occurred at 580 °C at the interface, accompanied by increased Cu diffusion within the Al matrix for a bonding time of 45 min. A Ti–Al-based intermetallic layer formed on the Ti side, but voids and cracks were present in the Al–Cu diffusion region at 580 °C. Hardness variation resulted from microstructural changes due to bonding temperature, particularly near the bond line due to hard intermetallic compounds. Shear strength averaged 41 MPa at 550 °C and decreased to 33 MPa at 580 °C due to grain growth, voids, and crack propagation, causing brittle joint failure at the interface. X-ray diffraction on the fracture surfaces revealed that the failure of diffusion-bonded joints is attributed to fractures through the Ti–Al-based intermetallic compounds at the interface and unbonded region.