材料科学
电镀(地质)
硅橡胶
结晶度
化学镀镍
复合材料
镍
天然橡胶
水溶液
化学工程
高分子化学
电镀
冶金
化学镀
化学
有机化学
地质学
图层(电子)
工程类
地球物理学
作者
Byeong Woo Lee,Jin Hee Lee
出处
期刊:한국표면공학회지
[The Korean Institute of Surface Engineering]
日期:2014-10-31
卷期号:47 (5): 269-274
被引量:1
标识
DOI:10.5695/jkise.2014.47.5.269
摘要
Electroless plating process as a solution deposition method is a viable means of preparing conductive metal films on non-conducting substrates through chemical reactions. In the present study, the preparation and properties of electroless Ni-plating on flexible silicone rubber are described. The process has been performed using a conventional Ni(P) chemical bath. Additives and complexing agents such as ammonium chloride and glycine were added and the reaction pH was controlled by NaOH aqueous solution. Ni deposition rate and crystallinity have been found to vary with pH and temperature of the plating bath. It was shown that Ni-films having the high crystallinity, enhanced adhesion and optimum electric conductivity were formed uniformly on silicone rubber substrates under pH 7 at $70^{\circ}C$. The conductive Ni-plated silicone rubber showed a high electromagnetic interference shielding effect in the 400 MHz-1 GHz range.
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