Research on the planarizaion of the large optic wafer in the fast polishing process

This paper researches on the planarization of the large optic wafer in the fast polishing process (FPP). In the FPP, the MRR (material removal rate) of the large optic wafer can reach 5~10 um/h. However, the planarization of the wafer is still a problem. Thus, this paper uses the revised skin model to analyze the non-uniform pressure distribution which results in the non-planarization of the wafer. At last, some experiments are done to see which parameter can be chosen to avoid the non-uniform pressure distribution and get the good wafer planarization.